TTram test is powert up test with patched 206. Also TOSCOPY used (as it copies and verifies ROM)
FROM COLD POWER UP - TTram tests fine.
FREEZER SPRAY on SDRAM & PLD - TTram tests fine.
HEATED UP (Gas iron) - TTram tests fine.
@Steve Yours has a bodge wire across the SDRAM clock line now. I was testing to see if the length was a issue or not (seems not so much) .
I think was been puzzling me probably the past three weeks is a thermal fault which I have simply not known about
like when the board has warmed up I could literally leave it running for days and it would not trip up even once. Leave it alone for a couple of days, and it was unstable again.. I would then mess around with the code and then think I have fixed it when in fact I haven't, and the board has simply warmed up and started working again.. I think this is why I have been constantly stuck going around in circles trying to figure out fault which was constantly "moving". I think the code changes also likely shifted the logic around just that tiny bit that it would shift the thermal profile in the IC adding another layer of problems.
I only caught onto this issue on Friday because it was hot in my room and everything was working fine until I put my big fan on in the window.. The temperature in my room dropped about half a degree, and then the board started being totally unstable even though nothing had changed over those few minutes..
It also seems that slow slew indeed required. Originally I think TF thought it was a issue with the SDRAM clock. I have serious resistors on the current board but it does not seem to have any effect. So it is currently a bit of a mystery (one I don't like) as to why fast slew causes problems.
When I tested slow and fast, there was virtually no difference between them..
